CY8C20234-12LKXI | Cypress Semiconductor

CY8C20234-12LKXI
Status: In Production

Datasheet

(pdf, 1.23 MB) PB Free
(pdf, 1.32 MB) PB Free

CY8C20234-12LKXI

Development KitCY3203A-DK
Automotive QualifiedN
CPU CoreM8C
CapSenseY
Comm. InterfaceI2C, SPI
Dedicated ADC (No._ Max. Resolution @ Sample Rate)DelSig (1, 10-bit @ 5.9 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)8
LCD Direct DriveN
Max. Operating Frequency (MHz)12
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.40
No. of CapSense Channels1
No. of CapSense IO10
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART0
No. of GPIOs13
No. of Programmable Digital Blocks0
PWMsSW
Proximity SensingN
SRAM (KB)0.5
SmartSense EnabledN
Tape & ReelN
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$1.77 $1.70 $1.62 $1.55 $1.48 $1.35
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 80 24-48 hours

Packaging/Ordering

Package
No. of Pins
16
Package Dimensions
118 L x 23 H x 118 W (Mils)
Package Weight
15.57 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
4900
Minimum Order Quantity (MOQ)
980
Order Increment
980
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au/Ag;Pure Sn

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Technical Reference Manuals (1)

Application Notes (18)

Development Kits/Boards (1)

Software and Drivers (2)

Product Change Notice (PCN) (10)

May 08, 2020
Qualification of Kostat Shipping Tray for Products in 16-QFN 3x3 Package
May 28, 2018
PSoC Product Datasheet Changes
May 28, 2018
Qualification of Grace Semiconductor as an alternate wafer fabrication site for the PSoC CY8C20xx4 product family
May 27, 2018
Standardization of Moisture Sensitive Level (MSL) Classification for 16-Lead QFN Pb - Free package assembled in Amkor-Phil
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Cypress Minnesota Inc. as an alternative wafer fabrication site and Copper Palladium as an alternative wire bond option for select PSoC Capsense Controller Product families
Oct 24, 2017
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products

Product Information Notice (PIN) (6)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Qualification of New Carrier Tape Supplier at Cypress Philippines
Nov 06, 2017
Changes to Cypress Address Labels

User Module Datasheets (12)

IBIS (1)

Mar 04, 2014

Technical Articles (2)