CY8C20180-LDX2I | Cypress Semiconductor

Status: Obsolete


Development KitCY3218-CAPEXP1
Automotive QualifiedN
Comm. InterfaceI2C
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.40
No. of CapSense IO8
No. of Dedicated I2C1
No. of Dedicated SPI0
No. of GPIOs8
No. of GPOsN/A
No. of PWM Channels0
Proximity SensingN
Slider SegmentsN/A
SmartSense EnabledN
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$1.22 $1.16 $1.11 $1.06 $1.01 $0.93
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times


No. of Pins
Package Dimensions
118 L x 23 H x 118 W (Mils)
Package Weight
15.57 (mgs)
Package Cross Section Drawing
Package Carrier
Package Carrier Drawing / Orientation
Standard Pack Quantity
Minimum Order Quantity (MOQ)
Order Increment
Estimated Lead Time (days)
HTS Code
ECCN Suball

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
PB Free
Lead/Ball Finish

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Technical Reference Manuals (1)

Application Notes (4)

Product Change Notice (PCN) (7)

May 08, 2020
Qualification of Kostat Shipping Tray for Products in 16-QFN 3x3 Package
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Cypress Minnesota Inc. as an alternative wafer fabrication site and Copper Palladium as an alternative wire bond option for select PSoC Capsense Controller Product families
Oct 24, 2017
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products

Advanced Product Change Notice (APCN) (2)

Apr 14, 2020
Q419 Horizon Report Update
Apr 14, 2020
Q419 Automotive Horizon Report Update

Product Information Notice (PIN) (7)

Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Product Reclassification to Non-Cancelable, Non-Returnable (NCNR)
Apr 14, 2020
Manufacturing Label and Packing Configuration Standardization
Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Qualification of New Carrier Tape Supplier at Cypress Philippines
Nov 06, 2017
Changes to Cypress Address Labels

Product Termination Notice (PTN) (2)

May 06, 2020
October 2019 Product Obsolescence Notification
Apr 14, 2020
Addendum to PTN194501 - October 2019 Product Obsolescence Notification

IBIS (1)

Mar 04, 2014