CY7C68053-56BAXIT | Cypress Semiconductor
CY7C68053-56BAXIT
| Development Kit | N/A |
| Application | USB High-Speed Peripherals |
| Automotive Qualified | N |
| CPU Core | Enhanced 8051 |
| Data Transfers | Bulk, Interrupt, Isochronous |
| I/O Options | 8/16-bit Databus, DMA, GPIO, I2C, UART |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 3.60 |
| Memory Architecture | RAM |
| Memory Size (KB) | 16 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 3.00 |
| No. of Endpoints | 7 |
| No. of I/Os | 24 |
| Software Tools | Keil S/W Tools (available from Keil) |
| Tape & Reel | Y |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $18.20 | $15.71 | $14.89 | $12.41 | $12.04 | $11.21 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
56
Package Dimensions
196 L x 1 H x 196 W (Mils)
Package Weight
50.90 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu
Marking
Package Material Declaration
Last Update: Nov 08, 2016
IPC 1752 Material Declaration
Last Update: May 21, 2020
Package Qualification Report
Last Update: Sep 17, 2016
Technical Documents
Technical Reference Manuals (1)
Application Notes (17)
May 28, 2020
Apr 04, 2018
Development Kits/Boards (1)
Product Change Notice (PCN) (6)
May 28, 2018
Qualification of Advanced Interconnect Technologies (AIT) as a New Assembly Site qualified for Pb-Free 56VFBGA 5x5x1.0mm, MSL3/260C Reflow using 98.5%Sn1%Ag0.5%Cu
May 28, 2018
Qualification of Grace Semiconductor Manufacturing Corporation as an Alternate Wafer Fab Site; FX2LP18 CY7C68053 Device Family
May 27, 2018
Qualification of Cypress Manufacturing Limited as an Additional Assembly Site for 56 Ball 5X5X1.0MM and 100 Ball 6X6X1.0MM VFBGA Packages
Advanced Product Change Notice (APCN) (1)
Feb 04, 2016
Advance Notification - Planned Addition of Grace Semiconductor Manufacturing Corporation (GSMC) as an Alternate Wafer Fab Site for C8 Technology; FX2LP18 CY7C68053* Device Family.
Product Information Notice (PIN) (7)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation