CY7C68014A-56PVXC | Cypress Semiconductor
CY7C68014A-56PVXC
| Development Kit | CY3684 |
| Application | USB High-Speed Peripherals |
| Automotive Qualified | N |
| CPU Core | Enhanced 8051 |
| Data Transfers | Bulk, Interrupt, Isochronous |
| I/O Options | 8/16-bit Databus, DMA, GPIO, I2C, UART |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating Voltage (V) | 3.60 |
| Memory Architecture | RAM |
| Memory Size (KB) | 16 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating Voltage (V) | 3.00 |
| No. of Endpoints | 7 |
| No. of I/Os | 24 |
| Software Tools | Keil S/W Tools (available from Keil) |
| Tape & Reel | N |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $13.46 | $12.55 | $11.63 | $11.02 | $8.87 | $8.26 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
56
Package Dimensions
725 L x 0 H x 295 W (Mils)
Package Weight
744.68 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
520
Minimum Order Quantity (MOQ)
52
Order Increment
52
Estimated Lead Time (days)
112
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991.A.3
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Pure Sn
Marking
IPC 1752 Material Declaration
Last Update: Aug 03, 2020
Package Qualification Report
Last Update: Aug 07, 2015
Technical Documents
Application Notes (17)
Nov 20, 2020
Apr 04, 2018
Product Change Notice (PCN) (18)
Sep 20, 2020
Addendum to PCN203103 - Transfer of Assembly Operations to Greatek Electronics Inc. for Select SOIC, SSOP and SOJ Packages
Jul 29, 2020
Transfer of Assembly Operations to Greatek Electronics Inc. for Select SOIC, SSOP and SOJ Packages
May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
May 08, 2020
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Apr 14, 2020
Qualification of OSE-T as an Additional Assembly Site for Select Pb-Free Products
May 28, 2018
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SSOP Packages.
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 27, 2018
Qualification of KYOCERA Green Mold Compound for Small Shrink Outline Packages (SSOP) assembled at Cypress Manufacturing Limited (CML)
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Advanced Product Change Notice (APCN) (3)
Product Information Notice (PIN) (6)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products