CY7C68013A-56BAXC | Cypress Semiconductor
CY7C68013A-56BAXC
| Development Kit | CY3684 |
| Application | USB High-Speed Peripherals |
| Automotive Qualified | N |
| CPU Core | Enhanced 8051 |
| Data Transfers | Bulk, Interrupt, Isochronous |
| I/O Options | 8/16-bit Databus, DMA, GPIO, I2C, UART |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating Voltage (V) | 3.60 |
| Memory Architecture | RAM |
| Memory Size (KB) | 16 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating Voltage (V) | 3.00 |
| No. of Endpoints | 7 |
| No. of I/Os | 24 |
| Software Tools | Keil S/W Tools (available from Keil) |
| Tape & Reel | N |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $10.52 | $9.80 | $9.08 | $8.60 | $6.93 | $6.45 |
Packaging/Ordering
Package
No. of Pins
56
Package Dimensions
196 L x 1 H x 196 W (Mils)
Package Weight
50.90 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
4900
Minimum Order Quantity (MOQ)
490
Order Increment
490
Estimated Lead Time (days)
126
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu
Marking
Package Material Declaration
Last Update: Nov 08, 2016
IPC 1752 Material Declaration
Last Update: Aug 21, 2020
Package Qualification Report
Last Update: Sep 17, 2016
Technical Documents
Technical Reference Manuals (1)
Application Notes (17)
Nov 20, 2020
Apr 04, 2018
Product Change Notice (PCN) (7)
May 28, 2018
Qualification of Advanced Interconnect Technologies (AIT) as a New Assembly Site qualified for Pb-Free 56VFBGA 5x5x1.0mm, MSL3/260C Reflow using 98.5%Sn1%Ag0.5%Cu
May 28, 2018
Qualification of Sn (98.5%)/Ag (1.0%)/Cu (0.5%) Solder Ball Composition for 6x8x1.0mm, 8x9.5x1.0mm, 6x6x1.0mm, and 5x5x1.0mm VFBGA packages assembled at ASE-Taiwan
May 27, 2018
Qualification of Cypress Manufacturing Limited as an Additional Assembly Site for 56 Ball 5X5X1.0MM and 100 Ball 6X6X1.0MM VFBGA Packages
Product Information Notice (PIN) (4)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization