CY7C65630-56LTXC | Cypress Semiconductor
CY7C65630-56LTXC
| Development Kit | CY4606 |
| Automotive Qualified | N |
| I/O Options | SPI |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating Voltage (V) | 3.45 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating Voltage (V) | 3.15 |
| No. of Hub Ports | 4 |
| Single/Multi TT | Single |
| Tape & Reel | N |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $15.31 | $13.22 | $12.52 | $10.44 | $10.13 | $9.43 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| In Stock | 170 | 24-48 hours | Contact Sales | Buy |
Packaging/Ordering
No. of Pins
56
Package Dimensions
315 L x 1 H x 315 W (Mils)
Package Weight
174.18 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
260
Minimum Order Quantity (MOQ)
260
Order Increment
260
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
(B.4.B)
ECCN Suball
5A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
Package Material Declaration
Last Update: Dec 08, 2016
IPC 1752 Material Declaration
IPC1752 MATERIAL DECLARATION QFN56 (8X8X1.0 mm) (LT56)_CML_Au WIRE_NiPdAu_HENKEL QMI519_NITTO GE7470
Last Update: May 22, 2020
Package Qualification Report
Qtp 92006 56-lead Saw Qfn (quad Flat No-lead) (8 X 8 X 1.0mm) Nipdau, Msl3, 260°c Reflow, Cml-ra.pdf
Last Update: Feb 17, 2019
Last Update: Dec 22, 2015
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Feb 17, 2019
Technical Documents
Application Notes (2)
Product Change Notice (PCN) (7)
Apr 23, 2020
Qualification of New Bill of Materials for QFN Pb-Free Packages Assembled at Cypress Philippines
Apr 14, 2020
Qualification of G700LA Mold Compound, Pure Sn Leadfinish and CuPdAu Wire for Select QFN Pb-Free Packages Assembled at ASE-KH
May 29, 2018
Qualification of Grace Semiconductor (GSMC) for HX2LP CY7C656xxx Product Family
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Advanced Product Change Notice (APCN) (2)
Product Information Notice (PIN) (4)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation