CY7C65620-56LTXC | Cypress Semiconductor

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CY7C65620-56LTXC
Status: In Production

Datasheet

(pdf, 816.71 KB) RoHS PB Free

CY7C65620-56LTXC

Development KitCY4605
Automotive QualifiedN
I/O OptionsSPI
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.45
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.15
No. of Hub Ports2
Single/Multi TTSingle
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$10.69 $9.23 $8.75 $7.29 $7.07 $6.59
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 190 24-48 hours

Packaging/Ordering

No. of Pins
56
Package Dimensions
315 L x 1 H x 315 W (Mils)
Package Weight
174.18 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
260
Minimum Order Quantity (MOQ)
260
Order Increment
260
Estimated Lead Time (days)
70
HTS Code
8542.31.0001
ECCN
(B.4.B)
ECCN Suball
5A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (7)

Apr 23, 2020
Qualification of New Bill of Materials for QFN Pb-Free Packages Assembled at Cypress Philippines
Apr 14, 2020
Qualification of G700LA Mold Compound, Pure Sn Leadfinish and CuPdAu Wire for Select QFN Pb-Free Packages Assembled at ASE-KH
May 29, 2018
Qualification of Grace Semiconductor (GSMC) for HX2LP CY7C656xxx Product Family
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products

Advanced Product Change Notice (APCN) (2)

Apr 14, 2020
Q419 Horizon Report Update
Apr 14, 2020
Q319 Horizon Report Update

Product Information Notice (PIN) (5)

Jul 28, 2020
USB Products Failure Analysis Policy Change
Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels

Errata (1)

Reference Designs (1)

IBIS (1)

Jun 02, 2010

Technical Articles (1)