CY7C64713-128AXC | Cypress Semiconductor
CY7C64713-128AXC
| Development Kit | CY3674 |
| Application | Other |
| Automotive Qualified | N |
| CPU Core | Enhanced 8051 |
| Data Transfers | Bulk, Interrupt, Isochronous |
| I/O Options | 8/16-bit Databus, DMA, GPIO, I2C, UART |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating Voltage (V) | 3.45 |
| Memory Architecture | RAM |
| Memory Size (KB) | 16 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating Voltage (V) | 3.15 |
| No. of Endpoints | 4 |
| No. of I/Os | 40 |
| Software Tools | Keil S/W Tools |
| Tape & Reel | N |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $11.88 | $10.26 | $9.72 | $8.10 | $7.86 | $7.32 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| In Stock | 120 | 24-48 hours | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
128
Package Dimensions
551 L x 1.4 H x 787 W (Mils)
Package Weight
974.84 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
720
Minimum Order Quantity (MOQ)
72
Order Increment
72
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
A.2
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Pure Sn
Marking
IPC 1752 Material Declaration
Package Qualification Report
Technical Documents
Application Notes (4)
Product Change Notice (PCN) (11)
May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
May 08, 2020
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
May 27, 2018
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Product Information Notice (PIN) (6)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products