CY7C64345-32LQXCT | Cypress Semiconductor
CY7C64345-32LQXCT
| Development Kit | CY3660 |
| Application | Gaming Mice, Keyboard, Joystick |
| Automotive Qualified | N |
| CPU Core | M8C |
| Data Transfers | Bulk, Interrupt, Isochronous |
| I/O Options | USB, GPIO, SPI, CLKIN/OUT, Vreg, ADC, I2C |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating Voltage (V) | 5.50 |
| Memory Architecture | Flash |
| Memory Size (KB) | 16 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating Voltage (V) | 3.00 |
| No. of Endpoints | 8 |
| No. of I/Os | 25 |
| Software Tools | PSoC Designer |
| Tape & Reel | Y |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $2.97 | $2.57 | $2.43 | $2.03 | $1.97 | $1.83 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
No. of Pins
32
Package Dimensions
196 L x 0.6 H x 196 W (Mils)
Package Weight
43.44 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
70
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
IPC 1752 Material Declaration
Package Qualification Report
Last Update: Sep 19, 2016
Last Update: Aug 07, 2015
Technical Documents
Technical Reference Manuals (1)
Application Notes (1)
Product Change Notice (PCN) (7)
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 28, 2018
Qualification of Cypress Philippines as an Additional Assembly Site for 32-Lead QFN (5x5x0.6 mm) Package Products Using the Saw Singulation Process
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Advanced Product Change Notice (APCN) (2)
Product Information Notice (PIN) (8)
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families