CY7C64215-56LTXI | Cypress Semiconductor
CY7C64215-56LTXI
| Development Kit | CY3664 |
| Application | Gaming Mice, Keyboard, Joystick |
| Automotive Qualified | N |
| CPU Core | M8 |
| Data Transfers | Bulk, Interrupt, Isochronous |
| I/O Options | I2C, 8-Bit UART, SPI, RF Interface |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 5.25 |
| Memory Architecture | Flash |
| Memory Size (KB) | 16 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 3.15 |
| No. of Endpoints | 4 |
| No. of I/Os | 50 |
| Software Tools | PSoC Designer |
| Tape & Reel | N |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $8.53 | $7.37 | $6.98 | $5.82 | $5.65 | $5.26 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
56
Package Dimensions
315 L x 1 H x 315 W (Mils)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
260
Minimum Order Quantity (MOQ)
260
Order Increment
260
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
Package Material Declaration
Last Update: Dec 08, 2016
IPC 1752 Material Declaration
IPC1752 MATERIAL DECLARATION QFN56 (8X8X1.0 mm) (LT56)_CML_Au WIRE_NiPdAu_HENKEL QMI519_NITTO GE7470
Last Update: Feb 04, 2020
Package Qualification Report
Qtp 92006 56-lead Saw Qfn (quad Flat No-lead) (8 X 8 X 1.0mm) Nipdau, Msl3, 260°c Reflow, Cml-ra.pdf
Last Update: Feb 17, 2019
Last Update: Dec 22, 2015
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Sep 20, 2016
Last Update: Sep 16, 2016
Technical Documents
Product Change Notice (PCN) (5)
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Advanced Product Change Notice (APCN) (2)
Product Information Notice (PIN) (5)
Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation