CY7C64215-28PVXC | Cypress Semiconductor
CY7C64215-28PVXC
| Development Kit | CY3664 |
| Application | Gaming Mice, Keyboard, Joystick |
| Automotive Qualified | N |
| CPU Core | M8C |
| Data Transfers | Bulk, Interrupt, Isochronous |
| I/O Options | I2C, 8-Bit UART, SPI, RF Interface |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating Voltage (V) | 5.25 |
| Memory Architecture | Flash |
| Memory Size (KB) | 16 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating Voltage (V) | 3.15 |
| No. of Endpoints | 4 |
| No. of I/Os | 22 |
| Software Tools | PSoC Designer |
| Tape & Reel | N |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $3.01 | $2.60 | $2.46 | $2.05 | $1.99 | $1.85 |
Packaging/Ordering
Package
No. of Pins
28
Package Dimensions
408 L x 0 H x 210 W (Mils)
Package Weight
229.90 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
1410
Minimum Order Quantity (MOQ)
1410
Order Increment
1410
Estimated Lead Time (days)
126
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
IPC 1752 Material Declaration
Last Update: Apr 30, 2020
Last Update: Feb 07, 2020
Last Update: Feb 05, 2020
Last Update: Feb 05, 2020
Package Qualification Report
Last Update: Aug 07, 2015
Last Update: Aug 07, 2015
Last Update: Aug 07, 2015
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Sep 16, 2016
Technical Documents
Development Kits/Boards (1)
Software and Drivers (1)
Product Change Notice (PCN) (11)
May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
May 28, 2018
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; enCoReTM III CY7C64215 Device Family
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 28, 2018
Standardization of Moisture Sensitive Level (MSL) Classification for 8,14, 16, 20, 24 and 28 Lead 209mils SSOP Pb-Free packages assembled in OSE Taiwan and Amkor-Phil
May 27, 2018
Qualification of Cypress Manufacturing Limited (CML) as an alternative assembly site for 20 and 28 lead 209mils SSOP Pb-Free package
Advanced Product Change Notice (APCN) (1)
Product Information Notice (PIN) (5)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation