CY7C63833-LTXCT | Cypress Semiconductor
CY7C63833-LTXCT
| Development Kit | CY3655 |
| Application | Mouse, Wireless Dongle |
| Automotive Qualified | N |
| CPU Core | M8C |
| Data Transfers | Interrupt |
| I/O Options | USB, PS/2, SPI, GPIO |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating Voltage (V) | 5.50 |
| Memory Architecture | Flash |
| Memory Size (KB) | 8 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating Voltage (V) | 4.00 |
| No. of Endpoints | 3 |
| No. of I/Os | 20 |
| Software Tools | C-Compiler (CY366x) |
| Tape & Reel | Y |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $2.46 | $2.12 | $2.01 | $1.67 | $1.62 | $1.51 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
32
Package Dimensions
196 L x 39.4 H x 196 W (Mils)
Package Weight
65.34 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
728
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991.A.3
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Pure Sn
Marking
IPC 1752 Material Declaration
Last Update: May 19, 2019
Package Qualification Report
Last Update: Sep 20, 2016
Last Update: Sep 19, 2016
Last Update: Aug 04, 2016
Last Update: Aug 07, 2015
Technical Documents
Application Notes (1)
Product Change Notice (PCN) (10)
May 08, 2020
Accelerated implementation schedules on PCN#s 084737, 094748-9, 094751, 094753-4 and 094757
Apr 23, 2020
Qualification of New Bill of Materials for QFN Pb-Free Packages Assembled at Cypress Philippines
May 28, 2018
Qualification of Cypress Philippines as an Additional Assembly Site for 32L Saw QFN Pb-free Package
May 28, 2018
Qualification of ASE Shanghai as an Additional Assembly Site for Pb-Free 32-Lead QFN (1.0 mm) Products Using the Saw Singulation Process
May 27, 2018
Qualification of Grace Semiconductor as an Additional Wafer Foundry site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Feb 08, 2016
Qualification of Amkor Philippines as an Additional Assembly Site for 32-lead QFN (1.0 mm) Products Using the Saw Singulation Process
Advanced Product Change Notice (APCN) (6)
Product Information Notice (PIN) (8)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation