CY7C63833-LTXC | Cypress Semiconductor

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CY7C63833-LTXC
Status: NRND: Contact Sales

Datasheet

(pdf, 860.67 KB) RoHS PB Free

CY7C63833-LTXC

Development KitCY3655
ApplicationMouse
Automotive QualifiedN
CPU CoreM8C
Data TransfersInterrupt
I/O OptionsUSB, PS/2, SPI, GPIO
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)5.50
Memory ArchitectureFlash
Memory Size (KB)8
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)4.00
No. of Endpoints3
No. of I/Os20
Software ToolsC-Compiler (CY366x)
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.46 $2.12 $2.01 $1.67 $1.62 $1.51
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
QFN
No. of Pins
32
Package Dimensions
196 L x 39.4 H x 196 W (Mils)
Package Weight
65.34 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
490
Minimum Order Quantity (MOQ)
490
Order Increment
490
Estimated Lead Time (days)
70
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

IPC 1752 Material Declaration

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: Sep 15, 2016

Technical Documents

Product Change Notice (PCN) (12)

May 08, 2020
Accelerated implementation schedules on PCN#s 084737, 094748-9, 094751, 094753-4 and 094757
Apr 23, 2020
Qualification of New Bill of Materials for QFN Pb-Free Packages Assembled at Cypress Philippines
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 28, 2018
Qualification of Cypress Philippines as an Additional Assembly Site for 32L Saw QFN Pb-free Package
May 28, 2018
Qualification of ASE Shanghai as an Additional Assembly Site for Pb-Free 32-Lead QFN (1.0 mm) Products Using the Saw Singulation Process
May 27, 2018
Qualification of Grace Semiconductor as an Additional Wafer Foundry site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Feb 08, 2016
Qualification of Amkor Philippines as an Additional Assembly Site for 32-lead QFN (1.0 mm) Products Using the Saw Singulation Process

Advanced Product Change Notice (APCN) (4)

Apr 22, 2020
Q220 Automotive Horizon Report Update
Apr 22, 2020
Q220 Standard Horizon Report Update
Apr 14, 2020
Q419 Horizon Report Update
Apr 14, 2020
Q319 Horizon Report Update

Product Information Notice (PIN) (5)

Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Manufacturing Label and Packing Configuration Standardization
Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels

Product Termination Notice (PTN) (2)

Apr 24, 2020
Addendum to PTN201304 - April 2020 Product Obsolescence Notification
Mar 29, 2020
April 2020 Product Obsolescence Notification