CY7C63823-SXCT | Cypress Semiconductor
CY7C63823-SXCT
| Development Kit | CY3655 |
| Application | Mouse |
| Automotive Qualified | N |
| CPU Core | M8C |
| Data Transfers | Interrupt |
| I/O Options | USB, PS/2, SPI, GPIO |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating Voltage (V) | 5.50 |
| Memory Architecture | Flash |
| Memory Size (KB) | 8 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating Voltage (V) | 4.00 |
| No. of Endpoints | 3 |
| No. of I/Os | 20 |
| Software Tools | C-Compiler (CY366x) |
| Tape & Reel | Y |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $2.81 | $2.43 | $2.30 | $1.92 | $1.86 | $1.73 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Contact Sales |
Packaging/Ordering
Package
No. of Pins
24
Package Dimensions
605 L x 0 H x 300 W (Mils)
Package Weight
658.05 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
119
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991.A.3
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
IPC 1752 Material Declaration
Last Update: Aug 03, 2020
Package Qualification Report
Last Update: Jul 21, 2019
Last Update: Jul 21, 2019
Technical Documents
Application Notes (1)
Product Change Notice (PCN) (7)
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select SOIC products
May 27, 2018
Qualification of Grace Semiconductor as an Additional Wafer Foundry site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Advanced Product Change Notice (APCN) (2)
Product Information Notice (PIN) (6)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation