CY7C63823-SXC | Cypress Semiconductor

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CY7C63823-SXC
Status: In Production

Datasheet

(pdf, 860.67 KB) RoHS PB Free

CY7C63823-SXC

Development KitCY3655
ApplicationMouse, Wireless Dongle
Automotive QualifiedN
CPU CoreM8C
Data TransfersInterrupt
I/O OptionsUSB, PS/2, SPI, GPIO
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)5.50
Memory ArchitectureFlash
Memory Size (KB)8
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)4.00
No. of Endpoints3
No. of I/Os20
Software ToolsC-Compiler (CY366x)
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.81 $2.43 $2.30 $1.92 $1.86 $1.73
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
SOP
No. of Pins
24
Package Dimensions
605 L x 0 H x 300 W (Mils)
Package Weight
658.05 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
1550
Minimum Order Quantity (MOQ)
3100
Order Increment
3100
Estimated Lead Time (days)
119
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991.A.3

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Technical Documents

Application Notes (1)

Product Change Notice (PCN) (16)

May 28, 2018
Qualification of Cypress Minnesota Inc. (CMI) as Second Source to SONOS4 Process, enCoRe II CY7C638XX, CY7C63310 Device Family
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select SOIC products
May 28, 2018
Qualification of KYOCERA KE-G3000DA as new MOLD COMPOUND for Pb-free packages built in Cypress Manufacturing Limited
May 28, 2018
Add Alternate Assembly Site for SOIC150mils Pb-Free
May 28, 2018
Add Alternate Assembly Site for SOIC300mils Pb-Free.
May 28, 2018
Standardization of Moisture Sensitivity Level (MSL) Classification for 18, 20 and 24 lead 300 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
May 27, 2018
Qualification of Grace Semiconductor as an Additional Wafer Foundry site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
May 27, 2018
Change in Tube Bundling Ship Process
May 27, 2018
Shipping Label Upgrade
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report

Advanced Product Change Notice (APCN) (2)

Aug 23, 2020
Q32020 Horizon Report Update
Apr 22, 2020
Q220 Standard Horizon Report Update

Product Information Notice (PIN) (4)

Jul 28, 2020
USB Products Failure Analysis Policy Change
Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.