CY7C63813-SXC | Cypress Semiconductor
CY7C63813-SXC
| Development Kit | CY3655 |
| Application | Mouse, Wireless Dongle |
| Automotive Qualified | N |
| CPU Core | M8C |
| Data Transfers | Interrupt |
| I/O Options | USB, PS/2, SPI, GPIO |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating Voltage (V) | 5.50 |
| Memory Architecture | Flash |
| Memory Size (KB) | 8 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating Voltage (V) | 4.00 |
| No. of Endpoints | 3 |
| No. of I/Os | 16 |
| Software Tools | C-Compiler (CY366x) |
| Tape & Reel | N |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $2.99 | $2.58 | $2.45 | $2.04 | $1.98 | $1.84 |
Packaging/Ordering
Package
No. of Pins
18
Package Dimensions
455 L x 1 H x 300 W (Mils)
Package Weight
495.50 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
2050
Minimum Order Quantity (MOQ)
1640
Order Increment
1640
Estimated Lead Time (days)
119
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
IPC 1752 Material Declaration
Last Update: Aug 05, 2020
Package Qualification Report
Last Update: Aug 07, 2015
Technical Documents
Application Notes (1)
Product Change Notice (PCN) (14)
May 28, 2018
Qualification of Cypress Minnesota Inc. (CMI) as Second Source to SONOS4 Process, enCoRe II CY7C638XX, CY7C63310 Device Family
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 28, 2018
Additional Assembly Site qualified for Pb-Free SOIC 300mils Packages with Pure Sn leadfinish
May 28, 2018
Standardization of Moisture Sensitivity Level (MSL) Classification for 18, 20 and 24 lead 300 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
May 27, 2018
Qualification of Grace Semiconductor as an Additional Wafer Foundry site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
May 27, 2018
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Oct 23, 2017
Qualification of Kyocera G3000DA/G6000DA Halogen-free Mold Compound for 18L SOIC package Assembled at Cypress, Philippines
Product Information Notice (PIN) (6)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation