CY7C63803-LQXC | Cypress Semiconductor

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CY7C63803-LQXC
Status: In Production

Datasheet

(pdf, 860.67 KB) RoHS PB Free

CY7C63803-LQXC

ApplicationMouse, Wireless Dongle
Automotive QualifiedN
CPU CoreM8C
Data TransfersInterrupt
I/O OptionsUSB, PS/2, SPI, GPIO
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)5.50
Memory ArchitectureFlash
Memory Size (KB)8
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)4.00
No. of Endpoints3
No. of I/Os14
Software ToolsC-Compiler (CY366x)
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.69 $2.33 $2.20 $1.84 $1.78 $1.66
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
24
Package Dimensions
157.5 L x 23.6 H x 157.5 W (Mils)
Package Weight
31.33 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
4900
Minimum Order Quantity (MOQ)
980
Order Increment
980
Estimated Lead Time (days)
70
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991.A.3

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Technical Documents

Application Notes (1)

Product Change Notice (PCN) (9)

Apr 23, 2020
Qualification of New Bill of Materials for QFN Pb-Free Packages Assembled at Cypress Philippines
May 29, 2018
Qualification of Cypress Philippines as an Additional Assembly Site for 24-Lead Pb-Free QFN (4X4X0.6mm) Package Products Using the Saw Singulation Process
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 28, 2018
Qualification of Amkor Philippines as an Additional Assembly Site for 24-lead QFN (4X4X0.6 mm)
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Apr 22, 2010
Qualification of Carsem Malaysia as an Additional Assembly Site for 24-lead QFN (4X4X0.6 mm) Package Products Using the Saw Singulation Process

Advanced Product Change Notice (APCN) (2)

Apr 14, 2020
Q419 Horizon Report Update
Apr 14, 2020
Q319 Horizon Report Update

Product Information Notice (PIN) (6)

Jul 28, 2020
USB Products Failure Analysis Policy Change
Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels