CY7C60455-48LTXCT | Cypress Semiconductor

CY7C60455-48LTXCT
Status: Obsolete

Datasheet

(pdf, 798.22 KB) RoHS PB Free

CY7C60455-48LTXCT

Development KitCY3660
ApplicationWireless Mouse, Remote Control, Presenter Tool, Medical Devices, Gaming Controllers, Other General Purpose Wireless Applications
Automotive QualifiedN
CPU CoreM8C
Code Memory ArchitectureFlash
Code Memory Size (KB)16
I/O OptionsGPIO, I2C, SPI, ADC
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.60
Max. Speed (MHz)24
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)1.71
No. of I/Os36
RAM Size (Bytes)1024
Software ToolsY
Tape & ReelY

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.87 $2.48 $2.35 $1.96 $1.90 $1.77
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
QFN
No. of Pins
48
Package Dimensions
276 L x 35 H x 276 W (Mils)
Package Weight
145.21 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Technical Documents

Application Notes (6)

Product Change Notice (PCN) (5)

May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 28, 2018
Qualification of Amkor Philippines as an Additional Assembly Site for 48 QFN (7X7X1.0mm) Package
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products

Advanced Product Change Notice (APCN) (4)

Aug 23, 2020
Q32020 Horizon Report Update
Jul 21, 2020
Q32020 Automotive Horizon Report Update
Apr 22, 2020
Q220 Automotive Horizon Report Update
Apr 22, 2020
Q220 Standard Horizon Report Update

Product Information Notice (PIN) (9)

Jul 28, 2020
USB Products Failure Analysis Policy Change
Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
Nov 06, 2017
Addendum to PIN145281: Qualification of New Carrier Tape Supplier at Cypress Philippines
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Qualification of New Carrier Tape Supplier at Cypress Philippines
Nov 06, 2017
Changes to Cypress Address Labels
Nov 06, 2017
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families

Product Termination Notice (PTN) (2)

Apr 24, 2020
Addendum to PTN201304 - April 2020 Product Obsolescence Notification
Mar 29, 2020
April 2020 Product Obsolescence Notification