CY7C60445-32LQXCT | Cypress Semiconductor
CY7C60445-32LQXCT
| Development Kit | CY3660 |
| Application | Wireless Mouse, Remote Control, Presenter Tool, Medical Devices, Gaming Controllers, Other General Purpose Wireless Applications |
| Automotive Qualified | N |
| CPU Core | M8C |
| Code Memory Architecture | Flash |
| Code Memory Size (KB) | 16 |
| I/O Options | GPIO, I2C, SPI, ADC |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating Voltage (V) | 3.60 |
| Max. Speed (MHz) | 24 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating Voltage (V) | 1.71 |
| No. of I/Os | 28 |
| RAM Size (Bytes) | 1024 |
| Software Tools | Y |
| Tape & Reel | Y |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $2.67 | $2.31 | $2.19 | $1.82 | $1.77 | $1.65 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Contact Sales |
Packaging/Ordering
No. of Pins
32
Package Dimensions
196 L x 0.6 H x 196 W (Mils)
Package Weight
43.44 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
IPC 1752 Material Declaration
Package Qualification Report
Last Update: Sep 19, 2016
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Sep 19, 2016
Technical Documents
Technical Reference Manuals (1)
Application Notes (6)
May 28, 2020
May 28, 2020
Development Kits/Boards (1)
Product Change Notice (PCN) (6)
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 28, 2018
Qualification of Cypress Philippines as an Additional Assembly Site for 32-Lead QFN (5x5x0.6 mm) Package Products Using the Saw Singulation Process
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Product Information Notice (PIN) (6)
Apr 14, 2020
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families