CY7C60445-32LQXCT | Cypress Semiconductor

Status: Obsolete


(pdf, 798.22 KB) RoHS PB Free


Development KitCY3660
ApplicationWireless Mouse, Remote Control, Presenter Tool, Medical Devices, Gaming Controllers, Other General Purpose Wireless Applications
Automotive QualifiedN
Code Memory ArchitectureFlash
Code Memory Size (KB)16
I/O OptionsGPIO, I2C, SPI, ADC
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.60
Max. Speed (MHz)24
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)1.71
No. of I/Os28
RAM Size (Bytes)1024
Software ToolsY
Tape & ReelY

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.67 $2.31 $2.19 $1.82 $1.77 $1.65
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times


No. of Pins
Package Dimensions
196 L x 0.6 H x 196 W (Mils)
Package Weight
43.44 (mgs)
Package Cross Section Drawing
Package Carrier
Package Carrier Drawing / Orientation
Standard Pack Quantity
Minimum Order Quantity (MOQ)
Order Increment
Estimated Lead Time (days)
HTS Code
ECCN Suball

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
PB Free
Lead/Ball Finish

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Technical Reference Manuals (1)

Application Notes (6)

Development Kits/Boards (1)

Product Change Notice (PCN) (6)

May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 28, 2018
Qualification of Cypress Philippines as an Additional Assembly Site for 32-Lead QFN (5x5x0.6 mm) Package Products Using the Saw Singulation Process
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Feb 08, 2016
Q1, 2009 - Q2, 2010 Horizon Report

Product Information Notice (PIN) (6)

May 06, 2020
Qualification of New Carrier Tape for QFN Packages at Cypress Philippines
Apr 14, 2020
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Qualification of New Carrier Tape Supplier at Cypress Philippines
Nov 06, 2017
Changes to Cypress Address Labels
Nov 06, 2017
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families

Product Termination Notice (PTN) (3)

Apr 14, 2020
Addendum to PTN173701A - October 2017 Product Obsolescence Notification
Apr 14, 2020
Addendum to PTN173701 - October 2017 Product Obsolescence Notification
Apr 14, 2020
October 2017 Product Obsolescence Notification