CY7C60223-QXC | Cypress Semiconductor

CY7C60223-QXC
Status: Obsolete

Datasheet

(pdf, 1.42 MB) RoHS PB Free

CY7C60223-QXC

ApplicationWireless Mouse, Remote Control, Presenter Tool, Medical Devices, Gaming Controllers, Other General Purpose Wireless Applications
Automotive QualifiedN
CPU CoreM8C
Code Memory ArchitectureFlash
Code Memory Size (KB)8
I/O OptionsGPIO, SPI
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.60
Max. Speed (MHz)12
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)2.70
No. of I/Os20
RAM Size (Bytes)256
Software ToolsY
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.57 $2.22 $2.11 $1.76 $1.70 $1.59
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
SOP
No. of Pins
24
Package Dimensions
340 L x 1 H x 150 W (Mils)
Package Weight
142.49 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
2750
Minimum Order Quantity (MOQ)
1925
Order Increment
1925
Estimated Lead Time (days)
364
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Pure Sn

Technical Documents

Application Notes (5)

Product Change Notice (PCN) (15)

May 08, 2020
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
May 28, 2018
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads QSOP package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 28, 2018
Datasheet changes to enCoRe(TM) II Low Voltage Products
May 27, 2018
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads SSOP package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
May 27, 2018
Qualification of Grace Semiconductor as an Additional Wafer Foundry site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
May 27, 2018
Change in Tube Bundling Ship Process
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China

Product Information Notice (PIN) (1)

Oct 25, 2017
Qualification of Kyocera Green Mold Compound: Information-Only Announcement