CY7C53120E4-40AXI | Cypress Semiconductor

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Status: In Production


(pdf, 539.48 KB) RoHS PB Free


Automotive QualifiedN
Flash (KB)4
Max. Input Clock (MHz)40
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.00
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)5.00
ROM (KB)12
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$13.38 $12.82 $12.26 $11.70 $11.14 $10.20
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 45 24-48 hours


No. of Pins
Package Dimensions
395 L x 1.4 H x 395 W (Mils)
Package Weight
285.67 (mgs)
Package Cross Section Drawing
Package Carrier
Package Carrier Drawing / Orientation
Standard Pack Quantity
Minimum Order Quantity (MOQ)
Order Increment
Estimated Lead Time (days)
HTS Code
ECCN Suball

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
PB Free
Lead/Ball Finish

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: May 15, 2013

Technical Documents

Application Notes (1)

Product Change Notice (PCN) (14)

May 28, 2018
Qualification of ASE Taiwan as an additional assembly site for 64-pin and 44-pin Thin Quad Flat Package (TQFP) products
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 28, 2018
Qualification of Cypress Minnesota as Alternate Wafer Fabrication Facility for Neuron® Chip Network Processor Products
May 27, 2018
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
May 27, 2018
Shipping Label Upgrade
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 24, 2018
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Advanced Product Change Notice (APCN) (2)

May 27, 2018
Advance Notification - Planned Changes to MoBL-USB TX3LP18
May 27, 2018
Advance Notification - Transfer of Specific Product Manufactured by Cypress Semiconductor Texas to Cypress Manufacturing Minnesota

Product Information Notice (PIN) (7)

Jan 07, 2020
Dec 21, 2019
Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
Changes to Cypress Address Labels
Nov 06, 2017
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
Oct 25, 2017
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Oct 25, 2017
Qualification of Kyocera Green Mold Compound: Information-Only Announcement