CY7C199D-10ZXIT | Cypress Semiconductor
CY7C199D-10ZXIT
| Automotive Qualified | N |
| Density (Kb) | 256 |
| Frequency (MHz) | N/A |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating VCCQ (V) | 5.50 |
| Max. Operating Voltage (V) | 5.50 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating VCCQ (V) | 4.50 |
| Min. Operating Voltage (V) | 4.50 |
| Organization (X x Y) | 32K x 8 |
| Part Family | Async Fast SRAMs |
| Speed (ns) | 10 |
| Tape & Reel | Y |
| Temp. Classification | Industrial |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $3.61 | $3.03 | $2.71 | $2.38 | $2.25 | $2.10 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
28
Package Dimensions
527 L x 1 H x 314 W (Mils)
Package Weight
247.33 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1500
Minimum Order Quantity (MOQ)
1500
Order Increment
1500
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au
Marking
Technical Documents
Application Notes (1)
Product Change Notice (PCN) (8)
May 08, 2020
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
May 08, 2020
Qualification of Polyimide Process for 90nm 1M, 2M, 4M and 8M density SRAM products.
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Advanced Product Change Notice (APCN) (1)
Product Information Notice (PIN) (8)
May 07, 2020
Qualification of ChipMOS, Taiwan as an Additional Finish Site for 28-Lead TSOP I Products
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
Nov 06, 2017
Addendum to PIN145281: Qualification of New Carrier Tape Supplier at Cypress Philippines