CY7C1474BV33-200BGXC | Cypress Semiconductor

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CY7C1474BV33-200BGXC
Status: In Production

Datasheet

(pdf, 1.03 MB) RoHS PB Free

CY7C1474BV33-200BGXC

ArchitectureNoBL, Pipeline
Automotive QualifiedN
Density (Kb)73728
Density (Mb)72
Frequency (MHz)200
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.63
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)2.40
Min. Operating Voltage (V)3.14
Organization (X x Y)1Mb x 72
Part FamilyNoBL
Part FamilyNoBL
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$156.80 $132.61 $128.13 $122.75 $119.17 $115.58
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
BGA
No. of Pins
209
Package Dimensions
866 L x 1.8 H x 551 W (Mils)
Package Weight
1,184.68 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
840
Minimum Order Quantity (MOQ)
84
Order Increment
84
Estimated Lead Time (days)
147
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Technical Documents

Application Notes (3)

Product Change Notice (PCN) (3)

Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products

Product Information Notice (PIN) (3)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
Changes to Cypress Address Labels

IBIS (1)

Jul 28, 2011

Verilog (1)

Jun 22, 2011

BSDL (1)

Jun 21, 2011