CY7C1470V25-200BZXC | Cypress Semiconductor

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CY7C1470V25-200BZXC
Status: In Production

Datasheet

(pdf, 767.28 KB) RoHS PB Free

CY7C1470V25-200BZXC

ArchitectureNoBL, Pipeline
Automotive QualifiedN
Density (Kb)73728
Density (Mb)72
Frequency (MHz)200
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)2.60
Max. Operating Voltage (V)2.63
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)2.40
Min. Operating Voltage (V)2.38
Organization (X x Y)2Mb x 36
Part FamilyNoBL
Part FamilyNoBL
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$179.71 $157.25 $153.88 $150.51 $147.14 $143.77
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
165
Package Dimensions
669 L x 1.4 H x 590 W (Mils)
Package Weight
645.61 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
1050
Minimum Order Quantity (MOQ)
105
Order Increment
105
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (3)

Product Change Notice (PCN) (6)

May 28, 2018
Qualification of JEDEC Shipping Tray for Sync and QDR SRAM products in 165 FBGA package
May 27, 2018
72Mb Synchronous SRAM CY7C14xx Family Revision B now released to full production
May 27, 2018
72M Synchronous SRAM design change to fix ZZ pin erratum and enhance internal test modes
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products

Product Information Notice (PIN) (3)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
Changes to Cypress Address Labels

Verilog (1)

Mar 17, 2015

IBIS (1)

Mar 15, 2011

BSDL (1)

Nov 13, 2008

VHDL (1)

Nov 13, 2008