CY7C1441AV33-133AXC | Cypress Semiconductor
CY7C1441AV33-133AXC
| Architecture | Standard Sync, Flow-through |
| Automotive Qualified | N |
| Density (Kb) | 36864 |
| Density (Mb) | 36 |
| Frequency (MHz) | 133 |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating VCCQ (V) | 3.60 |
| Max. Operating Voltage (V) | 3.63 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating VCCQ (V) | 2.40 |
| Min. Operating Voltage (V) | 3.14 |
| Organization (X x Y) | 1Mb x 36 |
| Tape & Reel | N |
| Temp. Classification | Commercial |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $62.16 | $55.44 | $51.41 | $47.38 | $45.70 | $43.68 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Contact Sales |
Packaging/Ordering
Package
No. of Pins
100
Package Dimensions
551 L x 1.4 H x 787 W (Mils)
Package Weight
913.01 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
720
Minimum Order Quantity (MOQ)
72
Order Increment
72
Estimated Lead Time (days)
728
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au
Marking
IPC 1752 Material Declaration
Technical Documents
Application Notes (2)
Product Change Notice (PCN) (12)
May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
May 08, 2020
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
May 27, 2018
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Oct 24, 2017
36Mb Standard Sync and NoBL SRAM Products: Technology Transition from 90nm to 65nm Process
Product Information Notice (PIN) (3)
Nov 06, 2017
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products