CY7C144-55AXC | Cypress Semiconductor
CY7C144-55AXC
| Automotive Qualified | N |
| Density (Kb) | 64 |
| Frequency (MHz) | N/A |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating VCCQ (V) | 5.50 |
| Max. Operating Voltage (V) | 5.50 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating VCCQ (V) | 4.50 |
| Min. Operating Voltage (V) | 4.50 |
| Organization (X x Y) | 8Kb x 8 |
| Speed (ns) | 55 |
| Tape & Reel | N |
| Temp. Classification | Commercial |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $21.22 | $17.51 | $16.23 | $14.85 | $14.22 | $13.58 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
64
Package Dimensions
551 L x 1.4 H x 551 W (Mils)
Package Weight
637.91 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
90
Minimum Order Quantity (MOQ)
90
Order Increment
90
Estimated Lead Time (days)
161
HTS Code
8542.32.0041
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
IPC 1752 Material Declaration
Last Update: Apr 06, 2020
Last Update: Nov 04, 2019
Technical Documents
Product Change Notice (PCN) (8)
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
May 28, 2018
Process Technology Transition from RAM28 (0.65um) to RAM42 (0.35um) for Select Dual Port Static RAM (DP-SRAM) Products
May 27, 2018
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML