CY7C1399BN-12ZXC | Cypress Semiconductor

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CY7C1399BN-12ZXC
Status: Obsolete

Datasheet

(pdf, 419.63 KB) RoHS PB Free

CY7C1399BN-12ZXC

Automotive QualifiedN
Density (Kb)256
Frequency (MHz)N/A
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)3.00
Min. Operating Voltage (V)3.00
Organization (X x Y)32K x 8
Part FamilyAsync Fast SRAMs
Speed (ns)12
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.51 $2.11 $1.88 $1.65 $1.56 $1.46
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
SOP
No. of Pins
28
Package Dimensions
527 L x 1 H x 314 W (Mils)
Package Weight
247.33 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
2340
Minimum Order Quantity (MOQ)
702
Order Increment
702
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

Technical Documents

Application Notes (1)

Product Change Notice (PCN) (9)

May 08, 2020
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 28, 2018
TSOP Tray Modification (Bottom Pocket Fence)
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China

Advanced Product Change Notice (APCN) (1)

Aug 23, 2020
Q32020 Horizon Report Update

Product Information Notice (PIN) (5)

Jun 14, 2020
Supply Update for Asynchronous SRAM 28-Lead TSOP (ZT28R) Package.
Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
May 07, 2020
Qualification of ChipMOS, Taiwan as an Additional Finish Site for 28-Lead TSOP I Products
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
Changes to Cypress Address Labels

Product Termination Notice (PTN) (3)

May 11, 2020
Addendum to PTN195105A - January 2020 Product Obsolescence Notification
Apr 14, 2020
Addendum to PTN195105 - January 2020 Product Obsolescence Notification
Apr 14, 2020
January 2020 Product Obsolescence Notification

White Papers (1)

VHDL (1)

Apr 02, 2012