CY7C1361C-100BZXE | Cypress Semiconductor

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CY7C1361C-100BZXE
Status: In Production

Datasheet

(pdf, 1.19 MB) RoHS PB Free

CY7C1361C-100BZXE

Development KitN/A
ArchitectureStandard Sync, Flow-through
Automotive QualifiedY
Density (Kb)9216
Density (Mb)9
Frequency (MHz)100
Max. Operating Temp. (°C)125
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.63
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.40
Min. Operating Voltage (V)3.14
Organization (X x Y)256Kb x 36
Tape & ReelN
Temp. ClassificationAutomotive(E)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
Contact Sales
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
BGA
No. of Pins
165
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
499.56 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1360
Minimum Order Quantity (MOQ)
136
Order Increment
136
Estimated Lead Time (days)
77
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991.B.2.B

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Package Material Declaration

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (1)

Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products

Product Information Notice (PIN) (2)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization