CY7C1360C-200BGC | Cypress Semiconductor

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CY7C1360C-200BGC
Status: In Production

Datasheet

(pdf, 1.17 MB)

CY7C1360C-200BGC

ArchitectureStandard Sync, Pipeline SCD
Automotive QualifiedN
Density (Kb)9216
Density (Mb)9
Frequency (MHz)200
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.63
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)2.40
Min. Operating Voltage (V)3.14
Organization (X x Y)256Kb x 36
Part FamilyStandard Sync
Part FamilyStandard Sync
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$14.02 $12.51 $11.60 $10.69 $10.31 $9.85
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 12 24-48 hours

Packaging/Ordering

Package
BGA
No. of Pins
119
Package Dimensions
866 L x 2.4 H x 551 W (Mils)
Package Weight
950.94 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
84
Minimum Order Quantity (MOQ)
84
Order Increment
84
Estimated Lead Time (days)
42
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
N
Lead/Ball Finish
Sn/Pb

Package Material Declaration

Last Update: Dec 14, 2016

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (5)

May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 27, 2018
Qualification of Green Mold Compound for select packages at ASE Taiwan
May 27, 2018
Qualification of 119 ball 14x22x2.4mm BGA SnPb Solder Ball Packages Assembled at Unisem
May 27, 2018
Change of assembly materials for all PBGA packages built in Advance Semiconductor Engineering (ASE) -Taiwan.
May 27, 2018
Shipping Label Upgrade

Product Information Notice (PIN) (1)

Nov 06, 2017
Changes to Cypress Address Labels

Verilog (1)

Jan 19, 2012

IBIS (1)

Jan 18, 2012

BSDL (1)

Jan 18, 2012

VHDL (1)

Nov 13, 2008