CY7C1354C-166BGCT | Cypress Semiconductor
CY7C1354C-166BGCT
Status: Obsolete
CY7C1354C-166BGCT
Architecture | NoBL, Pipeline |
Automotive Qualified | N |
Density (Kb) | 9216 |
Density (Mb) | 9 |
Frequency (MHz) | 166 |
Max. Operating Temp. (°C) | 70 |
Max. Operating VCCQ (V) | 3.60 |
Max. Operating Voltage (V) | 3.63 |
Min. Operating Temp. (°C) | 0 |
Min. Operating VCCQ (V) | 2.40 |
Min. Operating Voltage (V) | 3.14 |
Organization (X x Y) | 256Kb x 36 |
Tape & Reel | Y |
Temp. Classification | Commercial |
Pricing & Inventory Availability
1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
---|---|---|---|---|---|
$14.02 | $12.51 | $11.60 | $10.69 | $10.31 | $9.85 |
Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
---|---|---|---|---|
Out of Stock | 0 | Please click here to check lead times | Contact Sales | Contact Sales |
Packaging/Ordering
Package
No. of Pins
119
Package Dimensions
866 L x 2.4 H x 551 W (Mils)
Package Weight
950.94 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Standard Pack Quantity
500
Minimum Order Quantity (MOQ)
500
Order Increment
500
Estimated Lead Time (days)
42
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
220 (Cypress Reflow Profile)
RoHS Compliant
N
PB Free
N
Lead/Ball Finish
Sn/Pb
Marking
Package Material Declaration
Last Update: Dec 14, 2016
Technical Documents
Application Notes (3)
Product Change Notice (PCN) (4)
May 27, 2018
Qualification of 119 ball 14x22x2.4mm BGA SnPb Solder Ball Packages Assembled at Unisem
May 27, 2018
Change of assembly materials for all PBGA packages built in Advance Semiconductor Engineering (ASE) -Taiwan.