CY7C1347G-133BGXC | Cypress Semiconductor
CY7C1347G-133BGXC
Architecture | Standard Sync, Pipeline SCD |
Automotive Qualified | N |
Density (Kb) | 4096 |
Density (Mb) | 4 |
Frequency (MHz) | 133 |
Max. Operating Temp. (°C) | 70 |
Max. Operating VCCQ (V) | 3.60 |
Max. Operating Voltage (V) | 3.63 |
Min. Operating Temp. (°C) | 0 |
Min. Operating VCCQ (V) | 2.40 |
Min. Operating Voltage (V) | 3.14 |
Organization (X x Y) | 128Kb x 36 |
Tape & Reel | N |
Temp. Classification | Commercial |
Pricing & Inventory Availability
1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
---|---|---|---|---|---|
$8.07 | $7.19 | $6.67 | $6.15 | $5.93 | $5.67 |
Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
---|---|---|---|---|
Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
119
Package Dimensions
866 L x 2.4 H x 551 W (Mils)
Package Weight
985.75 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
840
Minimum Order Quantity (MOQ)
84
Order Increment
84
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu
Marking
Package Material Declaration
Last Update: Nov 10, 2016
IPC 1752 Material Declaration
Technical Documents
Application Notes (2)
Product Change Notice (PCN) (3)
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 28, 2018
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 119 ball 14x22x2.4mm BGA Packages Using SnAgCu Solder Balls