CY7C1318CV18-200BZI | Cypress Semiconductor
CY7C1318CV18-200BZI
Status: Obsolete
CY7C1318CV18-200BZI
Architecture | DDR-II CIO |
Automotive Qualified | N |
Burst Length (Words) | 2 |
Density (Kb) | 18432 |
Density (Mb) | 18 |
Frequency (MHz) | 200 |
Max. Operating Temp. (°C) | 85 |
Max. Operating VCCQ (V) | 1.90 |
Max. Operating Voltage (V) | 1.90 |
Min. Operating Temp. (°C) | -40 |
Min. Operating VCCQ (V) | 1.70 |
Min. Operating Voltage (V) | 1.70 |
Organization (X x Y) | 1Mb x 18 |
Tape & Reel | N |
Temp. Classification | Industrial |
Pricing & Inventory Availability
1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
---|---|---|---|---|---|
$28.32 | $25.26 | $23.42 | $21.59 | $20.82 | $19.90 |
Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
---|---|---|---|---|
Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
165
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
501.06 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
136
Minimum Order Quantity (MOQ)
136
Order Increment
136
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
220 (Cypress Reflow Profile)
RoHS Compliant
PB Free
N
Lead/Ball Finish
Sn/Pb
Marking
Package Material Declaration
Last Update: Sep 04, 2017
Technical Documents
Application Notes (5)
Product Change Notice (PCN) (2)
May 28, 2018
Release of 18M QDRII/DDRII/QDRII+/DDRII+ (Phase II) Synchronous SRAM Products in 65nm Technology
May 28, 2018
Qualification of JEDEC Shipping Tray for Sync and QDR SRAM products in 165 FBGA package