CY7C1312BV18-200BZI | Cypress Semiconductor

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CY7C1312BV18-200BZI
Status: Obsolete

CY7C1312BV18-200BZI

ArchitectureQDR-II
Automotive QualifiedN
Burst Length (Words)2
Density (Kb)18432
Density (Mb)18
Frequency (MHz)200
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)1.90
Max. Operating Voltage (V)1.90
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)1.40
Min. Operating Voltage (V)1.70
Organization (X x Y)1Mb x 18
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$33.36 $29.75 $27.59 $25.42 $24.52 $23.44
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
165
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
501.06 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
136
Minimum Order Quantity (MOQ)
136
Order Increment
136
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
N
Lead/Ball Finish
Sn/Pb

Package Material Declaration

Technical Documents

Application Notes (5)

Product Change Notice (PCN) (7)

May 28, 2018
Release of 18M QDRII/DDRII/QDRII+/DDRII+ (Phase II) Synchronous SRAM Products in 65nm Technology
May 28, 2018
Qualification of Cypress Manufacturing Limited as an additional assembly site for 165-FBGA. This supersedes the Advanced PCN No. 060981
May 28, 2018
Qualification of JEDEC Shipping Tray for Sync and QDR SRAM products in 165 FBGA package
May 28, 2018
Datasheet Changes to 18Mb/36Mb/72Mb Burst of 2/4 QDR-I/DDR-I/QDR-II/DDR-II Products
May 28, 2018
Subject: Qualification of 165 ball 13x15x1.4mm BGA Pb-Free and SnPb Solder Ball Packages
May 28, 2018
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 165 ball 13x15x1.4mm BGA Packages Using SnPb Solder Balls
May 27, 2018
Shipping Label Upgrade

Product Errata Notice (PEN) (1)

Oct 30, 2017
Product Errata Notification - RAM9 QDR-I/DDR-I/QDR-II/DDR-II Errata

IBIS (1)

Nov 13, 2008

VHDL (1)

Nov 13, 2008

Verilog (1)

Nov 13, 2008

BSDL (1)

Nov 13, 2008