CY7C1302DV25-167BZC | Cypress Semiconductor
CY7C1302DV25-167BZC
Status: Obsolete
Datasheet
(pdf, 628.8 KB)
CY7C1302DV25-167BZC
| Architecture | QDR |
| Automotive Qualified | N |
| Burst Length (Words) | 2 |
| Density (Kb) | 9216 |
| Density (Mb) | 9 |
| Frequency (MHz) | 167 |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating VCCQ (V) | 1.90 |
| Max. Operating Voltage (V) | 2.63 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating VCCQ (V) | 1.40 |
| Min. Operating Voltage (V) | 2.38 |
| Organization (X x Y) | 512Kb x 18 |
| Tape & Reel | N |
| Temp. Classification | Commercial |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $35.39 | $31.56 | $29.27 | $26.97 | $26.02 | $24.87 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
165
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
501.06 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
136
Minimum Order Quantity (MOQ)
136
Order Increment
136
Estimated Lead Time (days)
35
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
220 (Cypress Reflow Profile)
RoHS Compliant
N
PB Free
N
Lead/Ball Finish
Sn/Pb
Marking
Package Material Declaration
Last Update: Sep 04, 2017
Technical Documents
Application Notes (5)
Product Change Notice (PCN) (10)
May 28, 2018
Qualification of Cypress Manufacturing Limited as an additional assembly site for 165-FBGA. This supersedes the Advanced PCN No. 060981
May 28, 2018
Qualification of JEDEC Shipping Tray for Sync and QDR SRAM products in 165 FBGA package
May 28, 2018
Subject: Qualification of 165 ball 13x15x1.4mm BGA Pb-Free and SnPb Solder Ball Packages
May 28, 2018
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 165 ball 13x15x1.4mm BGA Packages Using SnPb Solder Balls
May 27, 2018
Change of assembly materials for all FBGA packages built in Advance Semiconductor Engineering (ASE) -Taiwan.