CY7C1168KV18-550BZXC | Cypress Semiconductor
CY7C1168KV18-550BZXC
| Architecture | DDR-II+ CIO |
| Automotive Qualified | N |
| Burst Length (Words) | 2 |
| Density (Kb) | 18432 |
| Density (Mb) | 18 |
| Frequency (MHz) | 550 |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating VCCQ (V) | 1.90 |
| Max. Operating Voltage (V) | 1.90 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating VCCQ (V) | 1.40 |
| Min. Operating Voltage (V) | 1.70 |
| Organization (X x Y) | 1Mb x 18 |
| Part Family | DDR-II+ CIO |
| Part Family | DDR-II+ CIO |
| Tape & Reel | N |
| Temp. Classification | Commercial |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $72.87 | $64.99 | $60.27 | $55.54 | $53.57 | $51.21 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
165
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
499.56 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1360
Minimum Order Quantity (MOQ)
136
Order Increment
136
Estimated Lead Time (days)
70
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu
Marking
Package Material Declaration
Last Update: Nov 09, 2016
Technical Documents
Application Notes (5)
Product Change Notice (PCN) (8)
Apr 14, 2020
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
Oct 24, 2017
Qualification of ASE Taiwan as an additional assembly site for 165 Ball Grid Array (BGA) packaged products
Oct 10, 2017
PCN154102 - Qualificationof Cypress Bangkok as an additional Assembly Site for Select 165 Ball Grid Array(BGA) Products
Product Information Notice (PIN) (3)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization