CY7C1071DV33-12BAXI | Cypress Semiconductor
CY7C1071DV33-12BAXI
| Automotive Qualified | N |
| Density (Kb) | 32768 |
| Frequency (MHz) | N/A |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| Max. Operating Voltage (V) | 3.60 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating VCCQ (V) | 3.00 |
| Min. Operating Voltage (V) | 3.00 |
| Organization (X x Y) | 2M x 16 |
| Part Family | Async Fast SRAMs |
| Speed (ns) | 12 |
| Tape & Reel | N |
| Temp. Classification | Industrial |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $108.32 | $91.91 | $89.94 | $87.31 | $86.00 | $84.03 |
Packaging/Ordering
Package
No. of Pins
48
Package Dimensions
374 L x 1.2 H x 315 W (Mils)
Package Weight
273.03 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
210
Minimum Order Quantity (MOQ)
210
Order Increment
210
Estimated Lead Time (days)
126
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991.B.2.B
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu
Marking
IPC 1752 Material Declaration
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Sep 21, 2016
Technical Documents
Application Notes (1)
Product Change Notice (PCN) (1)
Product Information Notice (PIN) (6)
Nov 07, 2017
Qualification of Die Attach Film for 48 Ball Grid Array (BGA) Stack Die Packages