CY7C1041BNL-15ZXCT | Cypress Semiconductor

You are here

CY7C1041BNL-15ZXCT
Status: Obsolete

CY7C1041BNL-15ZXCT

Automotive QualifiedN
Density (Kb)4096
Frequency (MHz)N/A
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)5.50
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)4.50
Min. Operating Voltage (V)4.50
Organization (X x Y)256K x 16
Speed (ns)15
Tape & ReelY
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$19.80 $16.65 $14.85 $13.05 $12.33 $11.52
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
42
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (1)

Product Change Notice (PCN) (5)

May 29, 2018
Correction to PCN 061134 4M Fast Asynchronous SRAM Process Technology Transition from R52FD-5R (0.25 micron) to C9FD-3R (90-nanometer) including Lead-Free(RoHS Compliant) Package Conversion on 32/36/44 Pin SOJ (Small Outline J-Bend)package and 44 pin TSOP II (Thin Shrunk Outline Package)
May 29, 2018
4M Fast Asynchronous SRAM Process Technology Transition from R52FD-5R (0.25 micron) to C9FD-3R (90-nanometer) including Lead-Free(RoHS Compliant) Package Conversion on 32/36/44 Pin SOJ (Small Outline J-Bend) package and 44 pin TSOP II (Thin Shrunk Outline Package)
May 28, 2018
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44lead TSOPII package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Oct 31, 2017
4Mb FAST and Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 250-, 180-, 130- and 90-nanometer to 65-nanometer Technology.

White Papers (1)

IBIS (1)

Nov 02, 2009

VHDL (1)

Sep 15, 2009