CY7C1021DV33-10VXI | Cypress Semiconductor

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CY7C1021DV33-10VXI
Status: In Production

Datasheet

(pdf, 394.53 KB) RoHS PB Free

CY7C1021DV33-10VXI

Automotive QualifiedN
Density (Kb)1024
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)3.00
Min. Operating Voltage (V)3.00
Organization (X x Y)64K x 16
Part FamilyAsync Fast SRAMs
Speed (ns)10
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.75 $2.31 $2.06 $1.81 $1.71 $1.60
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
SOP
No. of Pins
44
Package Dimensions
1 125 L x 0 H x 400 W (Mils)
Package Weight
1 785.53 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
850
Minimum Order Quantity (MOQ)
425
Order Increment
425
Estimated Lead Time (days)
364
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn

Technical Documents

Application Notes (1)

Product Change Notice (PCN) (15)

Sep 20, 2020
Addendum to PCN203103 - Transfer of Assembly Operations to Greatek Electronics Inc. for Select SOIC, SSOP and SOJ Packages
Jul 29, 2020
Transfer of Assembly Operations to Greatek Electronics Inc. for Select SOIC, SSOP and SOJ Packages
May 08, 2020
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
May 08, 2020
Qualification of Polyimide Process for 90nm 1M, 2M, 4M and 8M density SRAM products.
Apr 14, 2020
Qualification of OSE-T as an Additional Assembly Site for Select Pb-Free Products
Apr 14, 2020
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 27, 2018
Change in Tube Bundling Ship Process
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China

Advanced Product Change Notice (APCN) (4)

Aug 23, 2020
Q32020 Horizon Report Update
Apr 22, 2020
Q220 Standard Horizon Report Update
Apr 14, 2020
Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM Products
Apr 14, 2020
2020 Annual Horizon Report Update

Product Information Notice (PIN) (4)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
Changes to Cypress Address Labels
Nov 06, 2017
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products

White Papers (1)

VHDL (1)

Sep 15, 2009

IBIS (1)

Sep 15, 2009