CY7C1021BNV33L-15ZXI | Cypress Semiconductor

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CY7C1021BNV33L-15ZXI
Status: Obsolete

Datasheet

(pdf, 489.25 KB) RoHS PB Free

CY7C1021BNV33L-15ZXI

Automotive QualifiedN
Density (Kb)1024
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)3.00
Min. Operating Voltage (V)3.00
Organization (X x Y)64K x 16
Part FamilyAsync Fast SRAMs
Speed (ns)15
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$3.81 $3.20 $2.85 $2.51 $2.37 $2.21
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
405
Minimum Order Quantity (MOQ)
405
Order Increment
405
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991.B.2.B

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Technical Documents

Application Notes (1)

Product Change Notice (PCN) (13)

Jun 19, 2019
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
May 28, 2018
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44lead TSOPII package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 27, 2018
Qualification of Orient Semiconductor Electronics Ltd.- Taiwan (OSET) as an Additional Site for 44L TSOP 400mils Pb-Free Pacakge Qualification using Pure Sn Lead finish
May 27, 2018
Qualification of KYOCERA KE-G3000DA(For Non-SRAM Devices)/KE-G6000DA(For SRAM Devices) Green Mold Compound for 44lead TSOPII package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Product Information Notice (PIN) (3)

Nov 06, 2017
Changes to Cypress Address Labels
Oct 25, 2017
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Oct 25, 2017
Qualification of Kyocera Green Mold Compound: Information-Only Announcement

Product Termination Notice (PTN) (1)

Dec 23, 2018

White Papers (1)

VHDL (1)

Apr 02, 2012

IBIS (1)