CY7C1020CV26-15ZSXET | Cypress Semiconductor

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CY7C1020CV26-15ZSXET
Status: In Production

Datasheet

(pdf, 390.49 KB) RoHS PB Free

CY7C1020CV26-15ZSXET

Development KitN/A
Automotive QualifiedY
Density (Kb)512
Frequency (MHz)N/A
Max. Operating Temp. (°C)125
Max. Operating VCCQ (V)2.70
Max. Operating Voltage (V)2.70
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.50
Min. Operating Voltage (V)2.50
Organization (X x Y)32K x 16
Speed (ns)15
Tape & ReelY
Temp. ClassificationAutomotive(E)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$5.94 $5.00 $4.46 $3.92 $3.70 $3.46
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
SOP
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
168
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991.B.2.B

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

Technical Documents

Application Notes (1)

Product Change Notice (PCN) (8)

May 08, 2020
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
May 08, 2020
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products.
Apr 14, 2020
Qualification of OSE-T as an Additional Assembly Site for Select Automotive Products
May 29, 2018
Qualification of Chipmos,Taiwan as an additional Burn In site for 44 pin TSOP II Package for selected automotive grade SRAMs
May 28, 2018
Qualification of MEMC WFR008P as a new vendor of starting material for wafer fabrication
May 27, 2018
Shipping Label Upgrade
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 20, 2017
Qualification of Chipmos, Taiwan as an additional Test site for 44 pin TSOP II Package for selected automotive grade SRAMs

White Papers (1)

IBIS (1)

Jun 27, 2012