CY7C1011DV33-10BVXI | Cypress Semiconductor
CY7C1011DV33-10BVXI
| Development Kit | N/A |
| Automotive Qualified | N |
| Density (Kb) | 2048 |
| Frequency (MHz) | N/A |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| Max. Operating Voltage (V) | 3.60 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating VCCQ (V) | 3.00 |
| Min. Operating Voltage (V) | 3.00 |
| Organization (X x Y) | 128K x 16 |
| Part Family | Async Fast SRAMs |
| Speed (ns) | 10 |
| Tape & Reel | N |
| Temp. Classification | Industrial |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $5.81 | $4.88 | $4.36 | $3.83 | $3.62 | $3.38 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
48
Package Dimensions
314 L x 1 H x 236 W (Mils)
Package Weight
79.26 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
4800
Minimum Order Quantity (MOQ)
480
Order Increment
480
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu
Marking
IPC 1752 Material Declaration
Last Update: Jun 03, 2020
Last Update: Jun 26, 2018
Package Qualification Report
Last Update: Aug 07, 2015
Technical Documents
Application Notes (1)
Product Change Notice (PCN) (11)
May 08, 2020
Accelerated implementation schedules on PCN#s 084737, 094748-9, 094751, 094753-4 and 094757
May 08, 2020
Qualification of Polyimide Process for 90nm 1M, 2M, 4M and 8M density SRAM products.
Apr 14, 2020
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
May 28, 2018
Qualification of 48 ball 6x8x1.0mm BGA Pb-Free and SnPb Solder Ball Packages Assembled at AIT
May 28, 2018
Qualification of Sn (98.5%)/Ag (1.0%)/Cu (0.5%) Solder Ball Composition for 6x8x1.0mm, 8x9.5x1.0mm, 6x6x1.0mm, and 5x5x1.0mm VFBGA packages assembled at ASE-Taiwan
May 27, 2018
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads SSOP package for standard, Pb-Free and Green package application assembled at Cypress "Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 48BGA 6x8x1.0mm Pb-Free Package with Sn98.5%Ag1%Cu0.5% Solder Ball Finish
Product Information Notice (PIN) (3)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization