CY7C09389V-9AI | Cypress Semiconductor

CY7C09389V-9AI
Status: Obsolete

CY7C09389V-9AI

Automotive QualifiedN
Density (Kb)1024
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)3.00
Min. Operating Voltage (V)3.00
Organization (X x Y)64Kb x 18
Part FamilyStand. Sync Dual Ports
Speed (ns)9
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
Contact Sales
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
FP
No. of Pins
100
Package Dimensions
551 L x 1.4 H x 551 W (Mils)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
900
Minimum Order Quantity (MOQ)
90
Order Increment
90
Estimated Lead Time (days)
728
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
RoHS Compliant
N
PB Free
N
Lead/Ball Finish
Sn/Pb

Technical Documents

Product Change Notice (PCN) (10)

May 08, 2020
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
May 27, 2018
Add Palladium-Nickel-Gold Lead Finish to SOIC, QSOP, SNC, TQFP, TSOPI, TSOP II, TSSOP and SSOP Packages manufactured at CML.
May 27, 2018
Change of assembly materials for all TQFP packages built in Advance Semiconductor Engg (ASE)-Taiwan
May 27, 2018
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
May 27, 2018
Shipping Label Upgrade
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report

Product Information Notice (PIN) (1)

Oct 25, 2017
Qualification of Kyocera Green Mold Compound: Information-Only Announcement

Product Termination Notice (PTN) (2)

Apr 14, 2020
Addendum to PTN175005 - January 2018 Product Obsolescence NotificationParameter
Apr 14, 2020
January 2018 Product Obsolescence Notification

IBIS (1)

Nov 13, 2008