CY7C025-35AI | Cypress Semiconductor
CY7C025-35AI
Status: Obsolete
CY7C025-35AI
Automotive Qualified | N |
Density (Kb) | 128 |
Frequency (MHz) | N/A |
Max. Operating Temp. (°C) | 85 |
Max. Operating VCCQ (V) | 5.50 |
Max. Operating Voltage (V) | 5.50 |
Min. Operating Temp. (°C) | -40 |
Min. Operating VCCQ (V) | 4.50 |
Min. Operating Voltage (V) | 4.50 |
Organization (X x Y) | 8Kb x 16 |
Speed (ns) | 35 |
Tape & Reel | N |
Temp. Classification | Industrial |
Pricing & Inventory Availability
1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
---|---|---|---|---|---|
$38.76 | $31.98 | $29.65 | $27.13 | $25.97 | $24.81 |
Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
---|---|---|---|---|
Out of Stock | 0 | Please click here to check lead times | Contact Sales | Contact Sales |
Packaging/Ordering
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
235 (Cypress Reflow Profile)
RoHS Compliant
PB Free
N
Lead/Ball Finish
Ni/Pd/Au, Sn/Pb
Marking
Technical Documents
Product Change Notice (PCN) (8)
May 08, 2020
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
May 28, 2018
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 165 ball 13x15x1.4mm BGA Packages Using SnPb Solder Balls
May 27, 2018
Qualification of Grace Semiconductor as an Additional Wafer Foundry site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
May 27, 2018
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML