CY7B994V-2BBXC | Cypress Semiconductor

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CY7B994V-2BBXC
Status: Obsolete

Datasheet

(pdf, 584.61 KB) RoHS PB Free

CY7B994V-2BBXC

Automotive QualifiedN
Core Voltage (V)3.3
I/O Voltage (V)3.3
Input Frequency Max. (MHz)200
Input Frequency Min. (MHz)24
Input Signal TypeLVTTL, LVPECL
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.00
No. of Outputs18
No. of PLL1
Output Frequency Max. (MHz)200
Output Frequency Min. (MHz)24
Output Signal TypeLVTTL
Spread SpectrumN
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$53.39 $43.56 $41.03 $38.50 $37.37 $35.97
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
BGA
No. of Pins
100
Package Dimensions
435 L x 1.4 H x 435 W (Mils)
Package Weight
266.60 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
176
Minimum Order Quantity (MOQ)
176
Order Increment
176
Estimated Lead Time (days)
42
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Technical Documents

Product Change Notice (PCN) (6)

May 28, 2018
Improve Moisture Sensitivity Level of FBGA Pb-Free Products
May 28, 2018
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 100 ball 11x11x1.4mm BGA Packages Using SnAgCu Solder Balls
May 27, 2018
Shipping Label Upgrade
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products

Product Termination Notice (PTN) (1)

Nov 09, 2017
December 2012 Product Obsolescence Notification

IBIS (1)

Aug 12, 2010