CY7B923-400JXC | Cypress Semiconductor
CY7B923-400JXC
8B / 10B ENDEC | Y |
Automotive Qualified | N |
Functions | Transmitter |
Max. Operating Temp. (°C) | 70 |
Max. Operating Voltage (V) | 5.50 |
Max. Speed (Mbps) | 400 |
Min. Operating Temp. (°C) | 0 |
Min. Operating Voltage (V) | 4.50 |
Min. Speed (Mbps) | 150 |
Standard | Fibre Channel / ESCON / GE / DVBASI |
Tape & Reel | N |
Pricing & Inventory Availability
1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
---|---|---|---|---|---|
$118.27 | $113.31 | $108.35 | $103.38 | $98.42 | $90.15 |
Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
---|---|---|---|---|
Out of Stock | 0 | Please click here to check lead times | Contact Sales | Contact Sales |
Packaging/Ordering
Package
No. of Pins
28
Package Dimensions
454 L x 173 H x 454 W (Mils)
Package Weight
1 130.05 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
1850
Minimum Order Quantity (MOQ)
74
Order Increment
74
Estimated Lead Time (days)
182
HTS Code
8542.39.0001
ECCN
B.1
ECCN Suball
5A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Pure Sn
Marking
Technical Documents
Application Notes (22)
Jul 18, 2017
Jul 14, 2017
Product Change Notice (PCN) (8)
May 08, 2020
Qualification of C194 Leadframe for PLCC packages assembled at Amkor Philippines
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 28, 2018
Qualification of Reaction Technologies LPE 2061 EPI Reactor as an Alternate Process Step for BICMOS Technologies
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Product Information Notice (PIN) (4)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization