CY62256VNLL-70ZXI | Cypress Semiconductor
CY62256VNLL-70ZXI
| Automotive Qualified | N |
| Density (Kb) | 256 |
| Frequency (MHz) | N/A |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| Max. Operating Voltage (V) | 3.60 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 2.20 |
| Organization (X x Y) | 32K x 8 |
| Part Family | Async Micropower (MoBL) SRAMs |
| Speed (ns) | 70 |
| Tape & Reel | N |
| Temp. Classification | Industrial |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $3.19 | $2.68 | $2.39 | $2.10 | $1.99 | $1.86 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
28
Package Dimensions
527 L x 1 H x 314 W (Mils)
Package Weight
247.33 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
2340
Minimum Order Quantity (MOQ)
702
Order Increment
702
Estimated Lead Time (days)
364
HTS Code
8542.32.0041
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Pure Sn
Marking
Technical Documents
Application Notes (2)
Product Change Notice (PCN) (12)
Jan 22, 2021
Transfer of Assembly Operations to Greatek Electronics Inc. for Select 28-Lead TSOP I Package
May 08, 2020
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
May 28, 2018
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free TSOP-I 300mil Packages
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
May 28, 2018
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free TSOP-II 400mils Packages
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Advanced Product Change Notice (APCN) (1)
Product Information Notice (PIN) (5)
May 07, 2020
Qualification of ChipMOS, Taiwan as an Additional Finish Site for 28-Lead TSOP I Products
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization