CY62177EV30LL-55ZXI | Cypress Semiconductor

CY62177EV30LL-55ZXI
Status: In Production

Datasheet

(pdf, 498.54 KB) RoHS PB Free

CY62177EV30LL-55ZXI

Development KitN/A
AlarmsN
Automotive QualifiedN
Density (Kb)32768
Frequency (MHz)N/A
InterfaceParallel
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.20
Min. Operating Voltage (V)2.20
Organization (X x Y)2Mb x 16
Part FamilyAsync Micropower (MoBL) SRAMs
RTCN
Speed (ns)55
Tape & ReelN
Temp. ClassificationIndustrial
Watchdog TimerN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$56.88 $48.10 $46.15 $43.88 $42.90 $41.60
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 50 24-48 hours

Packaging/Ordering

Package
SOP
No. of Pins
48
Package Dimensions
472 L x 1.2 H x 787 W (Mils)
Package Weight
568.54 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
960
Minimum Order Quantity (MOQ)
96
Order Increment
96
Estimated Lead Time (days)
154
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Pure Sn

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (10)

Mar 30, 2021
Assembly Site and Bill of Materials Information for Select Industrial-Grade 32Mb MoBL® SRAM Product
May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
May 06, 2020
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
Apr 14, 2020
Qualification of UMC as an Alternate Wafer Fab Site for Select Industrial-Grade 32Mb MoBL SRAM Products
Apr 14, 2020
Qualification of Nitto EM-760L2 Die Attach Film for 48-Lead, Pb-Free, TSOP I Packages Assembled at OSE-Taiwan
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Oct 11, 2017
Qualification of PEAK Shipping Tray for 48-Lead TSOP I Products

Advanced Product Change Notice (APCN) (2)

Apr 14, 2020
Q419 Horizon Report Update
Apr 14, 2020
Q319 Horizon Report Update

Product Information Notice (PIN) (2)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization

White Papers (1)

VHDL (1)

Apr 02, 2012

IBIS (1)

May 07, 2011