CY62177EV30LL-55BAXI | Cypress Semiconductor

CY62177EV30LL-55BAXI
Status: In Production

Datasheet

(pdf, 498.54 KB) RoHS PB Free

CY62177EV30LL-55BAXI

Automotive QualifiedN
Density (Kb)32768
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.20
Min. Operating Voltage (V)2.20
Organization (X x Y)2M x 16
Part FamilyAsync Micropower (MoBL) SRAMs
Speed (ns)55
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$44.59 $36.38 $34.27 $32.15 $31.22 $30.04
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 50 24-48 hours

Packaging/Ordering

Package
No. of Pins
48
Package Dimensions
374 L x 1.2 H x 315 W (Mils)
Package Weight
273.03 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
2100
Minimum Order Quantity (MOQ)
210
Order Increment
210
Estimated Lead Time (days)
126
HTS Code
8542.32.0041
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (4)

Apr 14, 2020
Qualification of UMC as an Alternate Wafer Fab Site for Select Industrial-Grade 32Mb MoBL SRAM Products
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report

Advanced Product Change Notice (APCN) (2)

Apr 14, 2020
Q419 Horizon Report Update
Apr 14, 2020
Q319 Horizon Report Update

Product Information Notice (PIN) (5)

Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Manufacturing Label and Packing Configuration Standardization
Nov 07, 2017
Qualification of Die Attach Film for 48 Ball Grid Array (BGA) Stack Die Packages
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels

IBIS (1)

May 07, 2011