CY62168EV30LL-45BVXI | Cypress Semiconductor

CY62168EV30LL-45BVXI
Status: In Production

Datasheet

(pdf, 426.28 KB) RoHS PB Free

CY62168EV30LL-45BVXI

Development KitN/A
Automotive QualifiedN
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.20
Part FamilyAsync Micropower (MoBL) SRAMs
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$12.26 $10.29 $9.21 $8.06 $7.62 $7.11
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 120 24-48 hours

Packaging/Ordering

Package
BGA
No. of Pins
48
Package Dimensions
314 L x 1 H x 236 W (Mils)
Package Weight
79.26 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
4800
Minimum Order Quantity (MOQ)
480
Order Increment
480
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (10)

Apr 23, 2020
Qualification of UMC as an Alternate Wafer Fab Site for Select 16Mb MoBL SRAM Products
Apr 14, 2020
Addendum to PCN181402 - Serial Number Addition to Top Mark for BGA Parts at Cypress Bangkok
Apr 14, 2020
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
May 28, 2018
Qualification of 48 ball 6x8x1.0mm BGA Pb-Free and SnPb Solder Ball Packages Assembled at AIT
Feb 15, 2018
16Mb Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 150- and 90-nanometer to 65-nanometer Technology
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Apr 22, 2010
Qualification of Cypress Philippines as an Additional Assembly Site for 48BGA products

Advanced Product Change Notice (APCN) (2)

Apr 14, 2020
Q419 Horizon Report Update
Apr 14, 2020
Q319 Horizon Report Update

Product Information Notice (PIN) (4)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
90nm 16-Mbit (1M x 16/2M x 8) MoBL Industrial-Grade SRAM Product Family Datasheet Release
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels

White Papers (1)

IBIS (1)

Sep 02, 2009

VHDL (1)

Sep 02, 2009