CY62168DV30LL-55BVIT | Cypress Semiconductor

CY62168DV30LL-55BVIT
Status: Obsolete

Datasheet

(pdf, 474.31 KB) RoHS PB Free

CY62168DV30LL-55BVIT

Automotive QualifiedN
Density (Kb)16384
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.20
Organization (X x Y)2M x 8
Part FamilyAsync Micropower (MoBL) SRAMs
Speed (ns)55
Tape & ReelY
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$13.97 $11.75 $10.48 $9.21 $8.70 $8.13
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
BGA
No. of Pins
48
Package Dimensions
374 L x 1 H x 315 W (Mils)
Package Weight
158.56 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Pb

Package Material Declaration

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (10)

May 28, 2018
Change of wafer thickness from 11mils to 7mils for VFBGA packages assembled in CML Autoline
May 28, 2018
Qualification of MEMC WFR008P as a new vendor of starting material for wafer fabrication
May 28, 2018
Qualification of Grace Semiconductor Manufacturing Corporation (GSMC) as an Alternate Wafer Fab site for 16Mb, 3V MoBLTM SRAM, in R8NLD (0.13um) Process Technology
May 28, 2018
Qualification of 16M MoBLTM SRAM Devices in 90-nanometer Process Technology
May 27, 2018
Shipping Label Upgrade
Feb 15, 2018
16Mb Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 150- and 90-nanometer to 65-nanometer Technology
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products

Product Information Notice (PIN) (3)

Apr 14, 2020
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
Nov 06, 2017
Qualification of New Carrier Tape Supplier at Cypress Philippines
Nov 06, 2017
Changes to Cypress Address Labels

Product Termination Notice (PTN) (1)

Apr 14, 2020
January 2019 Product Obsolescence Notification

White Papers (1)

IBIS (1)

May 15, 2012

VHDL (1)

Apr 09, 2012